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  • Rochester Electronics MAX6626RMTT+T

    SENSOR DIGITAL -55C-125C 6TDFN
  • part number has RoHS
  • Mfr.Part # :MAX6626RMTT+T
  • Manufacturer :Rochester Electronics
  • Dasenic # :MAX6626RMTT+T-DS
  • Datasheet :pdf download MAX6626RMTT+T Datasheet
  • Description : SENSOR DIGITAL -55C-125C 6TDFN
  • Package :-
  • Quantity :
    Unit Price : $ 3.222Total : $ 3.22
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 13591
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 3.2220$ 3.22
10 +$ 2.5254$ 25.25
25 +$ 2.2918$ 57.30
100 +$ 1.9791$ 197.91
500 +$ 1.6695$ 834.75

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Rochester Electronics MAX6626RMTT+T technical specifications, attributes, parameters.
Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
Product Status:Active
Operating Temperature:-55°C ~ 125°C
Features:Output Switch, Programmable Limit, Shutdown Mode
Mounting Type:Surface Mount
Package / Case:6-WDFN Exposed Pad
Output Type:I²C
Supplier Device Package:6-TDFN (3x3)
Resolution:12 b
Voltage - Supply:3V ~ 5.5V
Sensor Type:Digital, Local
Test Condition:25°C (0°C ~ 70°C)
Sensing Temperature - Local:-55°C ~ 125°C
Sensing Temperature - Remote:-
Accuracy - Highest ( Lowest):±1°C (±2°C)
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX6626RMTT+T provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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