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Rochester Electronics LM56CIM-NS

DUAL TRIP POINT SWITCH/DIGITAL S
part number has RoHS
Manufacturer # :LM56CIM-NS
Manufacturer :Rochester Electronics
Dasenic # :LM56CIM-NS-DS
Customer # :
Description : DUAL TRIP POINT SWITCH/DIGITAL S
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.6709$ 1.67
200+$ 0.6472$ 129.44
500+$ 0.6243$ 312.15
1000+$ 0.6129$ 612.9
In Stock: 1080
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.6709
Total :$ 1.67
Delivery :
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Payment :
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LM56CIM-NS information

  • Rochester Electronics LM56CIM-NS technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Features:Output Switch
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Output Type:Analog Voltage
  • Supplier Device Package:8-SOIC
  • Resolution:6.2mV/°C
  • Voltage - Supply:2.7V ~ 10V
  • Sensor Type:Analog, Local
  • Test Condition:25°C (-40°C ~ 125°C)
  • Sensing Temperature - Local:-40°C ~ 125°C
  • Sensing Temperature - Remote:-
  • Accuracy - Highest ( Lowest):±3°C (±4°C)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM56CIM-NS provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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