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1 : $93.6900
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Rochester Electronics LFX200EB-03F516I
FPGA, 676 CLBS, 210000 GATES
Manufacturer # :LFX200EB-03F516I
Manufacturer :Rochester Electronics
Dasenic # :LFX200EB-03F516I-DS
Datasheet :
LFX200EB-03F516I Datasheet
LFX200EB-03F516I DatasheetCustomer # :
Description : FPGA, 676 CLBS, 210000 GATES
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 93.6900 | $ 93.69 |
| 25+ | $ 91.8180 | $ 2295.45 |
| 100+ | $ 88.0650 | $ 8806.5 |
| 500+ | $ 84.3210 | $ 42160.5 |
| 1000+ | $ 79.6410 | $ 79641 |
In Stock: 1536
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 93.69
Total :$ 93.69
Delivery :
Payment :
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LFX200EB-03F516I information
Rochester Electronics LFX200EB-03F516I technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:256-BGA
- Supplier Device Package:256-FPBGA (17x17)
- Voltage - Supply:2.3V ~ 3.6V
- Number of I/ O:-
- Number of L A Bs/ C L Bs:676
- Number of Logic Elements/ Cells:-
- Number of gates:210000
- Total R A M bits:113664
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LFX200EB-03F516I provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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