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Rochester Electronics LFSC3GA80E-6FC1152C

IC FPGA 660 I/O 1152FCBGA
part number has RoHS
Manufacturer # :LFSC3GA80E-6FC1152C
Manufacturer :Rochester Electronics
Dasenic # :LFSC3GA80E-6FC1152C-DS
Customer # :
Description : IC FPGA 660 I/O 1152FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1020.0060$ 1020.01
25+$ 999.6030$ 24990.08
100+$ 958.8060$ 95880.6
500+$ 918.0090$ 459004.5
1000+$ 867.0060$ 867006
In Stock: 1681
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1020.006
Total :$ 1020.01
Delivery :
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LFSC3GA80E-6FC1152C information

  • Rochester Electronics LFSC3GA80E-6FC1152C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:1152-BCBGA, FCBGA
  • Supplier Device Package:1152-CFCBGA (35x35)
  • Voltage - Supply:0.95V ~ 1.26V
  • Number of I/ O:660
  • Number of L A Bs/ C L Bs:20000
  • Number of Logic Elements/ Cells:80000
  • Number of gates:-
  • Total R A M bits:5816320
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991D
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LFSC3GA80E-6FC1152C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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