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  • Rochester Electronics LFSC3GA80E-5FCN1152C

    IC FPGA 660 I/O 1152FCBGA
  • part number has RoHS
  • Mfr.Part # :LFSC3GA80E-5FCN1152C
  • Manufacturer :Rochester Electronics
  • Dasenic # :LFSC3GA80E-5FCN1152C-DS
  • Datasheet :pdf download LFSC3GA80E-5FCN1152C Datasheet
  • Description : IC FPGA 660 I/O 1152FCBGA
  • Package :-
  • Quantity :
    Unit Price : $ 1888.9Total : $ 1888.90
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1507
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 1888.9000$ 1888.90
25 +$ 1851.1200$ 46278.00
100 +$ 1775.5600$ 177556.00
500 +$ 1700.0200$ 850010.00
1000 +$ 1605.5600$ 1605560.00

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Rochester Electronics LFSC3GA80E-5FCN1152C technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/FPGAs (Field Programmable Gate Array)
Product Status:Obsolete
Operating Temperature:0°C ~ 85°C (TJ)
Mounting Type:Surface Mount
Package / Case:1152-BBGA, FCBGA
Supplier Device Package:1152-FCBGA (35x35)
Voltage - Supply:0.95V ~ 1.26V
Number of I/ O:660
Number of L A Bs/ C L Bs:20000
Number of Logic Elements/ Cells:80000
Number of gates:-
Total R A M bits:5816320
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
LFSC3GA80E-5FCN1152C provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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