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Rochester Electronics IRGSL4062DPBF
IGBT W/ULTRAFAST SOFT RECOVERY D
Manufacturer # :IRGSL4062DPBF
Manufacturer :Rochester Electronics
Dasenic # :IRGSL4062DPBF-DS
Datasheet :
IRGSL4062DPBF Datasheet
IRGSL4062DPBF DatasheetCustomer # :
Description : IGBT W/ULTRAFAST SOFT RECOVERY D
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| Quantity | Unit Price | Total |
| 5+ | $ 0.9672 | $ 4.84 |
In Stock: 26653
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9672
Total :$ 0.97
Delivery :
Payment :
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IRGSL4062DPBF information
Rochester Electronics IRGSL4062DPBF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-262-3 Long Leads, I²Pak, TO-262AA
- Input Type:Standard
- Power - Max:250 W
- Supplier Device Package:TO-262
- Reverse Recovery Time (trr):89 ns
- Current - Collector ( Ic) ( Max):48 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Trench
- Vce(on) ( Max) @ Vge, Ic:1.95V @ 15V, 24A
- Current - Collector Pulsed ( Icm):96 A
- Switching Energy:115µJ (on), 600µJ (off)
- Gate Charge:50 nC
- Td (on/off) @ 25° C:41ns/104ns
- Test Condition:400V, 24A, 10Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRGSL4062DPBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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