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Rochester Electronics IRG7PH35UD-EP
Manufacturer # :IRG7PH35UD-EP
Manufacturer :Rochester Electronics
Dasenic # :IRG7PH35UD-EP-DS
Datasheet : IRG7PH35UD-EP Datasheet
Customer # :
Description : IGBT 1200V 50A COPAK247
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 13815
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.005
Total :$ 4.00
Delivery :
Payment :
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IRG7PH35UD-EP information
Rochester Electronics IRG7PH35UD-EP technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:180 W
- Supplier Device Package:TO-247AD
- Reverse Recovery Time (trr):105 ns
- Current - Collector ( Ic) ( Max):50 A
- Voltage - Collector Emitter Breakdown ( Max):1200 V
- I G B T Type:Trench
- Vce(on) ( Max) @ Vge, Ic:2.2V @ 15V, 20A
- Current - Collector Pulsed ( Icm):60 A
- Switching Energy:1.06mJ (on), 620µJ (off)
- Gate Charge:85 nC
- Td (on/off) @ 25° C:30ns/160ns
- Test Condition:600V, 20A, 10Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
IRG7PH35UD-EP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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