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Rochester Electronics IRG4BC30SPBF-INF
IGBT, 34A I(C), 600V V(BR)CES, N
Manufacturer # :IRG4BC30SPBF-INF
Manufacturer :Rochester Electronics
Dasenic # :IRG4BC30SPBF-INF-DS
Datasheet :
IRG4BC30SPBF-INF Datasheet
IRG4BC30SPBF-INF DatasheetCustomer # :
Description : IGBT, 34A I(C), 600V V(BR)CES, N
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 216+ | $ 2.7800 | $ 600.48 |
In Stock: 2566
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.78
Total :$ 2.78
Delivery :
Payment :
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IRG4BC30SPBF-INF information
Rochester Electronics IRG4BC30SPBF-INF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:100 W
- Supplier Device Package:TO-220AB
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):34 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:1.6V @ 15V, 18A
- Current - Collector Pulsed ( Icm):-
- Switching Energy:260µJ (on), 3.45mJ (off)
- Gate Charge:-
- Td (on/off) @ 25° C:22ns/540ns
- Test Condition:480V, 18A, 23Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRG4BC30SPBF-INF provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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