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Rochester Electronics IHW25N120E1XKSA1
Manufacturer # :IHW25N120E1XKSA1
Manufacturer :Rochester Electronics
Dasenic # :IHW25N120E1XKSA1-DS
Datasheet : IHW25N120E1XKSA1 Datasheet
Customer # :
Description : IGBT NPT/TRENCH 1200V 50A TO247
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10338
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.233
Total :$ 1.23
Delivery :
Payment :
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IHW25N120E1XKSA1 information
Rochester Electronics IHW25N120E1XKSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:231 W
- Supplier Device Package:PG-TO247-3
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):50 A
- Voltage - Collector Emitter Breakdown ( Max):1200 V
- I G B T Type:NPT and Trench
- Vce(on) ( Max) @ Vge, Ic:2V @ 15V, 25A
- Current - Collector Pulsed ( Icm):75 A
- Switching Energy:800µJ (off)
- Gate Charge:147 nC
- Td (on/off) @ 25° C:-
- Test Condition:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IHW25N120E1XKSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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