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Rochester Electronics IGA03N120H2

IGA03N120 - DISCRETE IGBT WITHOU
part number has RoHS
Manufacturer # :IGA03N120H2
Manufacturer :Rochester Electronics
Dasenic # :IGA03N120H2-DS
Customer # :
Description : IGA03N120 - DISCRETE IGBT WITHOU
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 3000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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IGA03N120H2 information

  • Rochester Electronics IGA03N120H2 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3 Full Pack
  • Input Type:Standard
  • Power - Max:29 W
  • Supplier Device Package:PG-TO220-3-31
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):8.2 A
  • Voltage - Collector Emitter Breakdown ( Max):1200 V
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:2.8V @ 15V, 3A
  • Current - Collector Pulsed ( Icm):9 A
  • Switching Energy:140µJ (on), 150µJ (off)
  • Gate Charge:8.6 nC
  • Td (on/off) @ 25° C:9.2ns/281ns
  • Test Condition:800V, 3A, 82Ohm, 15V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IGA03N120H2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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