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Rochester Electronics FS50R06KE3

FS50R06 - IGBT MODULE
part number has RoHS
Manufacturer # :FS50R06KE3
Manufacturer :Rochester Electronics
Dasenic # :FS50R06KE3-DS
Customer # :
Description : FS50R06 - IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 48.7080$ 48.71
25+$ 47.7360$ 1193.4
100+$ 45.7830$ 4578.3
500+$ 43.8390$ 21919.5
1000+$ 41.4000$ 41400
In Stock: 3996
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 48.708
Total :$ 48.71
Delivery :
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Payment :
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FS50R06KE3 information

  • Rochester Electronics FS50R06KE3 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Power - Max:-
  • Supplier Device Package:-
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Current - Collector Pulsed ( Icm):-
  • Switching Energy:-
  • Gate Charge:-
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FS50R06KE3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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