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Rochester Electronics FP50R07N2E4_B11

FP50R07 - IGBT MODULE
part number has RoHS
Manufacturer # :FP50R07N2E4_B11
Manufacturer :Rochester Electronics
Dasenic # :FP50R07N2E4_B11-DS
Customer # :
Description : FP50R07 - IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 61.7760$ 61.78
25+$ 60.5430$ 1513.58
100+$ 58.0680$ 5806.8
500+$ 55.6020$ 27801
1000+$ 52.5150$ 52515
In Stock: 1670
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 61.776
Total :$ 61.78
Delivery :
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FP50R07N2E4_B11 information

  • Rochester Electronics FP50R07N2E4_B11 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Power - Max:-
  • Supplier Device Package:-
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Current - Collector Pulsed ( Icm):-
  • Switching Energy:-
  • Gate Charge:-
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FP50R07N2E4_B11 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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