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Rochester Electronics EPF8820GM883B-3
FPGA, 672-CELL CPGA192
Manufacturer # :EPF8820GM883B-3
Manufacturer :Rochester Electronics
Dasenic # :EPF8820GM883B-3-DS
Datasheet :
EPF8820GM883B-3 Datasheet
EPF8820GM883B-3 DatasheetCustomer # :
Description : FPGA, 672-CELL CPGA192
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 507.9510 | $ 507.95 |
| 25+ | $ 497.7900 | $ 12444.75 |
| 100+ | $ 477.4770 | $ 47747.7 |
| 500+ | $ 457.1550 | $ 228577.5 |
| 1000+ | $ 431.7570 | $ 431757 |
In Stock: 1664
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 507.951
Total :$ 507.95
Delivery :
Payment :
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EPF8820GM883B-3 information
Rochester Electronics EPF8820GM883B-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TC)
- Mounting Type:Through Hole
- Package / Case:192-BCPGA
- Supplier Device Package:192-CPGA (44.7x44.7)
- Voltage - Supply:4.5V ~ 5.5V
- Number of I/ O:-
- Number of L A Bs/ C L Bs:84
- Number of Logic Elements/ Cells:672
- Number of gates:8000
- Total R A M bits:-
- HTSUS:8542.39.0001
- REACH Status:Vendor is not defined
- US ECCN:EAR99
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
- MSL Rating:3 (168 Hours, 30°C/60%RH)
EPF8820GM883B-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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