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Rochester Electronics EPF10K30ABI356-3

LOADABLE PLD, 0.9NS PBGA356
part number has RoHS
Manufacturer # :EPF10K30ABI356-3
Manufacturer :Rochester Electronics
Dasenic # :EPF10K30ABI356-3-DS
Customer # :
Description : LOADABLE PLD, 0.9NS PBGA356
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 111.2760$ 111.28
25+$ 109.0530$ 2726.33
100+$ 104.6070$ 10460.7
500+$ 100.1520$ 50076
1000+$ 94.5900$ 94590
In Stock: 1622
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 111.276
Total :$ 111.28
Delivery :
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EPF10K30ABI356-3 information

  • Rochester Electronics EPF10K30ABI356-3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:356-LBGA
  • Supplier Device Package:356-BGA (35x35)
  • Voltage - Supply:3V ~ 3.6V
  • Number of I/ O:246
  • Number of L A Bs/ C L Bs:216
  • Number of Logic Elements/ Cells:1728
  • Number of gates:69000
  • Total R A M bits:12288
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991D
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K30ABI356-3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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