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Rochester Electronics EPF10K200EGC599-1

LOADABLE PLD, 0.4NS CPGA599
part number has RoHS
Manufacturer # :EPF10K200EGC599-1
Manufacturer :Rochester Electronics
Dasenic # :EPF10K200EGC599-1-DS
Customer # :
Description : LOADABLE PLD, 0.4NS CPGA599
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1181.2680$ 1181.27
25+$ 1157.6430$ 28941.08
100+$ 1110.3930$ 111039.3
500+$ 1063.1430$ 531571.5
1000+$ 1004.0760$ 1004076
In Stock: 1623
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1181.268
Total :$ 1181.27
Delivery :
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Payment :
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EPF10K200EGC599-1 information

  • Rochester Electronics EPF10K200EGC599-1 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:599-BCPGA
  • Supplier Device Package:599-CPGA (62.48x62.48)
  • Voltage - Supply:2.375V ~ 2.625V
  • Number of I/ O:470
  • Number of L A Bs/ C L Bs:1248
  • Number of Logic Elements/ Cells:9984
  • Number of gates:513000
  • Total R A M bits:98304
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K200EGC599-1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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