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Rochester Electronics EPF10K130VBC600-3
LOADABLE PLD, 0.7NS PBGA600
Manufacturer # :EPF10K130VBC600-3
Manufacturer :Rochester Electronics
Dasenic # :EPF10K130VBC600-3-DS
Datasheet :
EPF10K130VBC600-3 Datasheet
EPF10K130VBC600-3 DatasheetCustomer # :
Description : LOADABLE PLD, 0.7NS PBGA600
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 308.7090 | $ 308.71 |
| 25+ | $ 302.5350 | $ 7563.38 |
| 100+ | $ 290.1870 | $ 29018.7 |
| 500+ | $ 277.8390 | $ 138919.5 |
| 1000+ | $ 262.4040 | $ 262404 |
In Stock: 1543
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 308.709
Total :$ 308.71
Delivery :
Payment :
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EPF10K130VBC600-3 information
Rochester Electronics EPF10K130VBC600-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:600-BGA
- Supplier Device Package:600-BGA (45x45)
- Voltage - Supply:3V ~ 3.6V
- Number of I/ O:470
- Number of L A Bs/ C L Bs:832
- Number of Logic Elements/ Cells:6656
- Number of gates:211000
- Total R A M bits:32768
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K130VBC600-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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