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Rochester Electronics EPF10K100BFC256-2

LOADABLE PLD, 12NS PBGA256
part number has RoHS
Manufacturer # :EPF10K100BFC256-2
Manufacturer :Rochester Electronics
Dasenic # :EPF10K100BFC256-2-DS
Customer # :
Description : LOADABLE PLD, 12NS PBGA256
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 95.5530$ 95.55
25+$ 93.6450$ 2341.13
100+$ 89.8200$ 8982
500+$ 85.9950$ 42997.5
1000+$ 81.2250$ 81225
In Stock: 4638
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 95.553
Total :$ 95.55
Delivery :
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EPF10K100BFC256-2 information

  • Rochester Electronics EPF10K100BFC256-2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-FBGA (17x17)
  • Voltage - Supply:4.75V ~ 5.25V
  • Number of I/ O:-
  • Number of L A Bs/ C L Bs:72
  • Number of Logic Elements/ Cells:576
  • Number of gates:31000
  • Total R A M bits:6144
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:3A991
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K100BFC256-2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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