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1 : $15.0530
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Rochester Electronics EP20K60EQC208-2
IC FPGA 148 I/O 208QFP
Manufacturer # :EP20K60EQC208-2
Manufacturer :Rochester Electronics
Dasenic # :EP20K60EQC208-2-DS
Datasheet :
EP20K60EQC208-2 Datasheet
EP20K60EQC208-2 DatasheetCustomer # :
Description : IC FPGA 148 I/O 208QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 7+ | $ 15.0530 | $ 105.37 |
| 10+ | $ 14.7520 | $ 147.52 |
| 100+ | $ 14.3004 | $ 1430.04 |
| 500+ | $ 13.8488 | $ 6924.4 |
| 1000+ | $ 13.5477 | $ 13547.7 |
In Stock: 8027
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.053
Total :$ 15.05
Delivery :
Payment :
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EP20K60EQC208-2 information
Rochester Electronics EP20K60EQC208-2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP
- Supplier Device Package:208-PQFP (28x28)
- Voltage - Supply:1.71V ~ 1.89V
- Number of I/ O:148
- Number of L A Bs/ C L Bs:-
- Number of Logic Elements/ Cells:-
- Number of gates:-
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EP20K60EQC208-2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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