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1 : $76.0680
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Rochester Electronics EP20K60EFC324-2
IC FPGA 196 I/O 324FBGA
Manufacturer # :EP20K60EFC324-2
Manufacturer :Rochester Electronics
Dasenic # :EP20K60EFC324-2-DS
Datasheet :
EP20K60EFC324-2 Datasheet
EP20K60EFC324-2 DatasheetCustomer # :
Description : IC FPGA 196 I/O 324FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 76.0680 | $ 76.07 |
| 25+ | $ 74.5470 | $ 1863.68 |
| 100+ | $ 71.5050 | $ 7150.5 |
| 500+ | $ 68.4630 | $ 34231.5 |
| 1000+ | $ 64.6560 | $ 64656 |
In Stock: 1600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 76.068
Total :$ 76.07
Delivery :
Payment :
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EP20K60EFC324-2 information
Rochester Electronics EP20K60EFC324-2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:324-BGA
- Supplier Device Package:324-FBGA (19x19)
- Voltage - Supply:1.71V ~ 1.89V
- Number of I/ O:196
- Number of L A Bs/ C L Bs:2560
- Number of Logic Elements/ Cells:2560
- Number of gates:162000
- Total R A M bits:32768
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP20K60EFC324-2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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