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1 : $0.7280
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Rochester Electronics DB1P
BRIDGE RECTIFIER DIODE
Manufacturer # :DB1P
Manufacturer :Rochester Electronics
Dasenic # :DB1P-DS
Datasheet :
DB1P Datasheet
DB1P DatasheetCustomer # :
Description : BRIDGE RECTIFIER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.7280 | $ 0.73 |
| 25+ | $ 0.7134 | $ 17.84 |
| 100+ | $ 0.6844 | $ 68.44 |
| 500+ | $ 0.6552 | $ 327.6 |
| 1000+ | $ 0.6188 | $ 618.8 |
In Stock: 1518
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.728
Total :$ 0.73
Delivery :
Payment :
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DB1P information
Rochester Electronics DB1P technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Bridge Rectifiers
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:4-EDIP (0.321", 8.15mm)
- Technology:Standard
- Supplier Device Package:BR-4
- Diode Type:Single Phase
- Voltage - Peak Reverse ( Max):1 kV
- Current - Average Rectified ( Io):1 A
- Voltage - Forward ( Vf) ( Max) @ If:1.1 V @ 1 A
- Current - Reverse Leakage @ Vr:10 µA @ 1000 V
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8541.10.0080
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DB1P provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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