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Rochester Electronics DB1F

BRIDGE RECTIFIER DIODE, 1A, 50V
part number has RoHS
Manufacturer # :DB1F
Manufacturer :Rochester Electronics
Dasenic # :DB1F-DS
Datasheet :pdf download DB1F Datasheet
Customer # :
Description : BRIDGE RECTIFIER DIODE, 1A, 50V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2145$ 0.21
25+$ 0.2102$ 5.26
100+$ 0.2016$ 20.16
500+$ 0.1931$ 96.55
1000+$ 0.1823$ 182.3
In Stock: 8105
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2145
Total :$ 0.21
Delivery :
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Payment :
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DB1F information

  • Rochester Electronics DB1F technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Bridge Rectifiers
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:4-Square, BR
  • Technology:Standard
  • Supplier Device Package:BR
  • Diode Type:Single Phase
  • Voltage - Peak Reverse ( Max):50 V
  • Current - Average Rectified ( Io):1 A
  • Voltage - Forward ( Vf) ( Max) @ If:1.1 V @ 1 A
  • Current - Reverse Leakage @ Vr:10 µA @ 50 V
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8541.10.0080
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DB1F provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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