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1 : $12.3000
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Rochester Electronics 3N187
N-CHANNEL POWER MOSFET
Manufacturer # :3N187
Manufacturer :Rochester Electronics
Dasenic # :3N187-DS
Datasheet :
3N187 Datasheet
3N187 DatasheetCustomer # :
Description : N-CHANNEL POWER MOSFET
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 12.3000 | $ 12.3 |
| 100+ | $ 9.2400 | $ 924 |
| 1000+ | $ 8.0000 | $ 8000 |
In Stock: 1503
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.3
Total :$ 12.30
Delivery :
Payment :
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3N187 information
Rochester Electronics 3N187 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - JFETs
- Product Status:Active
- Operating Temperature:-65°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-206AF, TO-72-4 Metal Can
- Power - Max:330 mW
- Supplier Device Package:TO-72
- F E T Type:N-Channel
- Drain to Source Voltage ( Vdss):20 V
- Input Capacitance ( Ciss) ( Max) @ Vds:8.5pF @ 15V
- Voltage - Breakdown ( V( B R) G S S):6.5 V
- Current - Drain ( Idss) @ Vds ( Vgs=0):5 mA @ 15 V
- Current Drain ( Id) - Max:-
- Voltage - Cutoff ( V G S off) @ Id:500 mV @ 50 µA
- Resistance - R D S( On):-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
3N187 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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