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Rochester Electronics AD22100KT
SENSOR ANALOG 0C-100C TO92-3
Manufacturer # :AD22100KT
Manufacturer :Rochester Electronics
Dasenic # :AD22100KT-DS
Datasheet :
AD22100KT Datasheet
AD22100KT DatasheetCustomer # :
Description : SENSOR ANALOG 0C-100C TO92-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.1380 | $ 6.14 |
| 10+ | $ 4.8096 | $ 48.1 |
| 25+ | $ 4.3654 | $ 109.14 |
| 100+ | $ 3.9713 | $ 397.13 |
| 1000+ | $ 3.0150 | $ 3015 |
In Stock: 3624
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.138
Total :$ 6.14
Delivery :
Payment :
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AD22100KT information
Rochester Electronics AD22100KT technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
- Product Status:Active
- Operating Temperature:-50°C ~ 150°C
- Features:-
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 (TO-226AA)
- Output Type:Analog Voltage
- Supplier Device Package:TO-92-3
- Resolution:22.5mV/°C
- Voltage - Supply:4V ~ 6.5V
- Sensor Type:Analog, Local
- Test Condition:25°C
- Sensing Temperature - Local:0°C ~ 100°C
- Sensing Temperature - Remote:-
- Accuracy - Highest ( Lowest):±2°C
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AD22100KT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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