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Rochester Electronics SGS23N60UFDTU

IGBT, 23A I(C), 600V V(BR)CES, N
part number has RoHS
Manufacturer # :SGS23N60UFDTU
Manufacturer :Rochester Electronics
Dasenic # :SGS23N60UFDTU-DS
Customer # :
Description : IGBT, 23A I(C), 600V V(BR)CES, N
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.5580$ 0.56
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.558
Total :$ 0.56
Delivery :
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SGS23N60UFDTU information

  • Rochester Electronics SGS23N60UFDTU technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3 Full Pack
  • Input Type:Standard
  • Power - Max:73 W
  • Supplier Device Package:TO-220F
  • Reverse Recovery Time (trr):60 ns
  • Current - Collector ( Ic) ( Max):23 A
  • Voltage - Collector Emitter Breakdown ( Max):600 V
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:2.6V @ 15V, 12A
  • Current - Collector Pulsed ( Icm):92 A
  • Switching Energy:115µJ (on), 135µJ (off)
  • Gate Charge:49 nC
  • Td (on/off) @ 25° C:17ns/60ns
  • Test Condition:300V, 12A, 23Ohm, 15V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SGS23N60UFDTU provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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