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Rochester Electronics SGP13N60UFDTU
Manufacturer # :SGP13N60UFDTU
Manufacturer :Rochester Electronics
Dasenic # :SGP13N60UFDTU-DS
Datasheet : SGP13N60UFDTU Datasheet
Customer # :
Description : N-CHANNEL IGBT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11612
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.134
Total :$ 1.13
Delivery :
Payment :
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SGP13N60UFDTU information
Rochester Electronics SGP13N60UFDTU technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:60 W
- Supplier Device Package:TO-220-3
- Reverse Recovery Time (trr):55 ns
- Current - Collector ( Ic) ( Max):13 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.6V @ 15V, 6.5A
- Current - Collector Pulsed ( Icm):52 A
- Switching Energy:85µJ (on), 95µJ (off)
- Gate Charge:25 nC
- Td (on/off) @ 25° C:20ns/70ns
- Test Condition:300V, 6.5A, 50Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SGP13N60UFDTU provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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