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1 : $6.5160
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Rochester Electronics AT6002-2QI
IC FPGA 96 I/O 132BQFP
Manufacturer # :AT6002-2QI
Manufacturer :Rochester Electronics
Dasenic # :AT6002-2QI-DS
Datasheet :
AT6002-2QI Datasheet
AT6002-2QI DatasheetCustomer # :
Description : IC FPGA 96 I/O 132BQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.5160 | $ 6.52 |
| 25+ | $ 6.3810 | $ 159.53 |
| 100+ | $ 6.1200 | $ 612 |
| 500+ | $ 5.8590 | $ 2929.5 |
| 1000+ | $ 5.5350 | $ 5535 |
In Stock: 11736
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.516
Total :$ 6.52
Delivery :
Payment :
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AT6002-2QI information
Rochester Electronics AT6002-2QI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:132-BQFP Bumpered
- Supplier Device Package:132-BQFP (27.44x27.44)
- Voltage - Supply:4.5V ~ 5.5V
- Number of I/ O:96
- Number of L A Bs/ C L Bs:-
- Number of Logic Elements/ Cells:1024
- Number of gates:6000
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AT6002-2QI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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