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Rochester Electronics ICE65L08F-TCS110I
IC FPGA 92 I/O 110WLCSP
Manufacturer # :ICE65L08F-TCS110I
Manufacturer :Rochester Electronics
Dasenic # :ICE65L08F-TCS110I-DS
Datasheet :
ICE65L08F-TCS110I Datasheet
ICE65L08F-TCS110I DatasheetCustomer # :
Description : IC FPGA 92 I/O 110WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 10.7820 | $ 10.78 |
| 25+ | $ 10.5660 | $ 264.15 |
| 100+ | $ 10.1340 | $ 1013.4 |
| 500+ | $ 9.7020 | $ 4851 |
| 1000+ | $ 9.1620 | $ 9162 |
In Stock: 32904
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.782
Total :$ 10.78
Delivery :
Payment :
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ICE65L08F-TCS110I information
Rochester Electronics ICE65L08F-TCS110I technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:-
- Supplier Device Package:110-WLCSP
- Voltage - Supply:1.14V ~ 1.26V
- Number of I/ O:92
- Number of L A Bs/ C L Bs:960
- Number of Logic Elements/ Cells:7680
- Number of gates:-
- Total R A M bits:131072
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ICE65L08F-TCS110I provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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