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1 : $12.9218
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Rochester Electronics EPF6016ATC100-1
IC FPGA 81 I/O 100TQFP
Manufacturer # :EPF6016ATC100-1
Manufacturer :Rochester Electronics
Dasenic # :EPF6016ATC100-1-DS
Datasheet :
EPF6016ATC100-1 Datasheet
EPF6016ATC100-1 DatasheetCustomer # :
Description : IC FPGA 81 I/O 100TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 7+ | $ 12.9218 | $ 90.45 |
| 10+ | $ 12.6634 | $ 126.63 |
| 100+ | $ 12.2756 | $ 1227.56 |
| 500+ | $ 11.8880 | $ 5944 |
| 1000+ | $ 11.6296 | $ 11629.6 |
In Stock: 39467
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.9218
Total :$ 12.92
Delivery :
Payment :
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EPF6016ATC100-1 information
Rochester Electronics EPF6016ATC100-1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:100-TQFP
- Supplier Device Package:100-TQFP (14x14)
- Voltage - Supply:3V ~ 3.6V
- Number of I/ O:81
- Number of L A Bs/ C L Bs:132
- Number of Logic Elements/ Cells:-
- Number of gates:-
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF6016ATC100-1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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