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Rochester Electronics EPF10K30EFC256-2
IC FPGA 176 I/O 256FBGA
Manufacturer # :EPF10K30EFC256-2
Manufacturer :Rochester Electronics
Dasenic # :EPF10K30EFC256-2-DS
Datasheet :
EPF10K30EFC256-2 Datasheet
EPF10K30EFC256-2 DatasheetCustomer # :
Description : IC FPGA 176 I/O 256FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 74.2590 | $ 74.26 |
| 25+ | $ 72.7740 | $ 1819.35 |
| 100+ | $ 69.8040 | $ 6980.4 |
| 500+ | $ 66.8340 | $ 33417 |
| 1000+ | $ 63.1170 | $ 63117 |
In Stock: 3462
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 74.259
Total :$ 74.26
Delivery :
Payment :
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EPF10K30EFC256-2 information
Rochester Electronics EPF10K30EFC256-2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:256-BGA
- Supplier Device Package:256-FBGA (17x17)
- Voltage - Supply:2.375V ~ 2.625V
- Number of I/ O:176
- Number of L A Bs/ C L Bs:216
- Number of Logic Elements/ Cells:-
- Number of gates:-
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EPF10K30EFC256-2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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