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Rochester Electronics EPF10K30EFC256-1X

IC FPGA 176 I/O 256FBGA
part number has RoHS
Manufacturer # :EPF10K30EFC256-1X
Manufacturer :Rochester Electronics
Dasenic # :EPF10K30EFC256-1X-DS
Customer # :
Description : IC FPGA 176 I/O 256FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 115.9200$ 115.92
25+$ 113.5980$ 2839.95
100+$ 108.9630$ 10896.3
500+$ 104.3280$ 52164
1000+$ 98.5320$ 98532
In Stock: 1578
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 115.92
Total :$ 115.92
Delivery :
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EPF10K30EFC256-1X information

  • Rochester Electronics EPF10K30EFC256-1X technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-FBGA (17x17)
  • Voltage - Supply:2.375V ~ 2.625V
  • Number of I/ O:176
  • Number of L A Bs/ C L Bs:216
  • Number of Logic Elements/ Cells:1728
  • Number of gates:119000
  • Total R A M bits:24576
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K30EFC256-1X provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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