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Rochester Electronics EP2SGX30DF780C4N
IC FPGA 361 I/O 780FBGA
Manufacturer # :EP2SGX30DF780C4N
Manufacturer :Rochester Electronics
Dasenic # :EP2SGX30DF780C4N-DS
Datasheet :
EP2SGX30DF780C4N Datasheet
EP2SGX30DF780C4N DatasheetCustomer # :
Description : IC FPGA 361 I/O 780FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1086.1200 | $ 1086.12 |
| 25+ | $ 1064.4000 | $ 26610 |
| 100+ | $ 1020.9600 | $ 102096 |
| 500+ | $ 977.5000 | $ 488750 |
| 1000+ | $ 923.2000 | $ 923200 |
In Stock: 1508
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1086.12
Total :$ 1086.12
Delivery :
Payment :
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EP2SGX30DF780C4N information
Rochester Electronics EP2SGX30DF780C4N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:780-BBGA, FCBGA
- Supplier Device Package:780-FBGA (29x29)
- Voltage - Supply:1.15V ~ 1.25V
- Number of I/ O:361
- Number of L A Bs/ C L Bs:1694
- Number of Logic Elements/ Cells:33880
- Number of gates:-
- Total R A M bits:1369728
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP2SGX30DF780C4N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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