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1 : $254.7990
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Rochester Electronics EP2S90F1020C3N
IC FPGA 758 I/O 1020FBGA
Manufacturer # :EP2S90F1020C3N
Manufacturer :Rochester Electronics
Dasenic # :EP2S90F1020C3N-DS
Datasheet :
EP2S90F1020C3N Datasheet
EP2S90F1020C3N DatasheetCustomer # :
Description : IC FPGA 758 I/O 1020FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 254.7990 | $ 254.8 |
| 10+ | $ 251.4510 | $ 2514.51 |
| 25+ | $ 248.1840 | $ 6204.6 |
| 250+ | $ 241.9020 | $ 60475.5 |
| 500+ | $ 235.9260 | $ 117963 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 254.799
Total :$ 254.80
Delivery :
Payment :
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EP2S90F1020C3N information
Rochester Electronics EP2S90F1020C3N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:1020-BBGA, FCBGA
- Supplier Device Package:1020-FBGA (33x33)
- Voltage - Supply:1.15V ~ 1.25V
- Number of I/ O:758
- Number of L A Bs/ C L Bs:4548
- Number of Logic Elements/ Cells:90960
- Number of gates:-
- Total R A M bits:4520488
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP2S90F1020C3N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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