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Rochester Electronics EP2S180F1020C5
IC FPGA 742 I/O 1020FBGA
Manufacturer # :EP2S180F1020C5
Manufacturer :Rochester Electronics
Dasenic # :EP2S180F1020C5-DS
Datasheet :
EP2S180F1020C5 Datasheet
EP2S180F1020C5 DatasheetCustomer # :
Description : IC FPGA 742 I/O 1020FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5336.7660 | $ 5336.77 |
| 25+ | $ 5230.0350 | $ 130750.88 |
| 100+ | $ 5016.5640 | $ 501656.4 |
| 500+ | $ 4803.0930 | $ 2401546.5 |
| 1000+ | $ 4536.2520 | $ 4536252 |
In Stock: 1820
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5336.766
Total :$ 5336.77
Delivery :
Payment :
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EP2S180F1020C5 information
Rochester Electronics EP2S180F1020C5 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:1020-BBGA, FCBGA
- Supplier Device Package:1020-FBGA (33x33)
- Voltage - Supply:1.15V ~ 1.25V
- Number of I/ O:742
- Number of L A Bs/ C L Bs:8970
- Number of Logic Elements/ Cells:179400
- Number of gates:-
- Total R A M bits:9383040
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP2S180F1020C5 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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