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Rochester Electronics EP20K200EQC208-2X
IC FPGA 136 I/O 208QFP
Manufacturer # :EP20K200EQC208-2X
Manufacturer :Rochester Electronics
Dasenic # :EP20K200EQC208-2X-DS
Datasheet :
EP20K200EQC208-2X Datasheet
EP20K200EQC208-2X DatasheetCustomer # :
Description : IC FPGA 136 I/O 208QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1814.0441 | $ 1814.04 |
| 25+ | $ 1777.7381 | $ 44443.45 |
| 100+ | $ 1705.1999 | $ 170519.99 |
| 500+ | $ 1632.6618 | $ 816330.9 |
| 1000+ | $ 1541.9338 | $ 1541933.8 |
In Stock: 1558
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1814.0441
Total :$ 1814.04
Delivery :
Payment :
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EP20K200EQC208-2X information
Rochester Electronics EP20K200EQC208-2X technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP
- Supplier Device Package:208-PQFP (28x28)
- Voltage - Supply:1.71V ~ 1.89V
- Number of I/ O:136
- Number of L A Bs/ C L Bs:832
- Number of Logic Elements/ Cells:-
- Number of gates:-
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP20K200EQC208-2X provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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