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Rochester Electronics EP20K200CF484C9
IC FPGA 376 I/O 484FBGA
Manufacturer # :EP20K200CF484C9
Manufacturer :Rochester Electronics
Dasenic # :EP20K200CF484C9-DS
Datasheet :
EP20K200CF484C9 Datasheet
EP20K200CF484C9 DatasheetCustomer # :
Description : IC FPGA 376 I/O 484FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 337.6800 | $ 337.68 |
| 25+ | $ 330.9300 | $ 8273.25 |
| 100+ | $ 317.4210 | $ 31742.1 |
| 500+ | $ 303.9120 | $ 151956 |
| 1000+ | $ 287.0280 | $ 287028 |
In Stock: 1616
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 337.68
Total :$ 337.68
Delivery :
Payment :
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EP20K200CF484C9 information
Rochester Electronics EP20K200CF484C9 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:484-BBGA
- Supplier Device Package:484-FBGA (23x23)
- Voltage - Supply:1.71V ~ 1.89V
- Number of I/ O:376
- Number of L A Bs/ C L Bs:832
- Number of Logic Elements/ Cells:8320
- Number of gates:526000
- Total R A M bits:106496
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP20K200CF484C9 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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