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Rochester Electronics IRGP6660D-EPBF
Manufacturer # :IRGP6660D-EPBF
Manufacturer :Rochester Electronics
Dasenic # :IRGP6660D-EPBF-DS
Datasheet : IRGP6660D-EPBF Datasheet
Customer # :
Description : IGBT WITH RECOVERY DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3270
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.222
Total :$ 3.22
Delivery :
Payment :
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IRGP6660D-EPBF information
Rochester Electronics IRGP6660D-EPBF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:330 W
- Supplier Device Package:TO-247AD
- Reverse Recovery Time (trr):70 ns
- Current - Collector ( Ic) ( Max):95 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:1.95V @ 15V, 48A
- Current - Collector Pulsed ( Icm):144 A
- Switching Energy:600µJ (on), 1.3mJ (off)
- Gate Charge:95 nC
- Td (on/off) @ 25° C:60ns/155ns
- Test Condition:400V, 48A, 10Ohm, 15V
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8541.29.0095
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
IRGP6660D-EPBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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