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Rochester Electronics AUIRGB4062D1
IGBT, 59A I(C), 600V V(BR)CES, N
Manufacturer # :AUIRGB4062D1
Manufacturer :Rochester Electronics
Dasenic # :AUIRGB4062D1-DS
Datasheet :
AUIRGB4062D1 Datasheet
AUIRGB4062D1 DatasheetCustomer # :
Description : IGBT, 59A I(C), 600V V(BR)CES, N
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| Quantity | Unit Price | Total |
In Stock: 2108
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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Payment :
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AUIRGB4062D1 information
Rochester Electronics AUIRGB4062D1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:246 W
- Supplier Device Package:TO-220AB
- Reverse Recovery Time (trr):102 ns
- Current - Collector ( Ic) ( Max):59 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Trench
- Vce(on) ( Max) @ Vge, Ic:1.77V @ 15V, 24A
- Current - Collector Pulsed ( Icm):72 A
- Switching Energy:532µJ (on), 311µJ (off)
- Gate Charge:77 nC
- Td (on/off) @ 25° C:19ns/90ns
- Test Condition:400V, 24A, 10Ohm, 15V
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AUIRGB4062D1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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