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Rochester Electronics FGB5N60UNDF
Manufacturer # :FGB5N60UNDF
Manufacturer :Rochester Electronics
Dasenic # :FGB5N60UNDF-DS
Datasheet : FGB5N60UNDF Datasheet
Customer # :
Description : INSULATED GATE BIPOLAR TRANSISTO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4380
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7994
Total :$ 0.80
Delivery :
Payment :
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FGB5N60UNDF information
Rochester Electronics FGB5N60UNDF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
- Input Type:Standard
- Power - Max:73.5 W
- Supplier Device Package:TO-263AB (D2PAK)
- Reverse Recovery Time (trr):35 ns
- Current - Collector ( Ic) ( Max):10 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:NPT
- Vce(on) ( Max) @ Vge, Ic:2.4V @ 15V, 5A
- Current - Collector Pulsed ( Icm):15 A
- Switching Energy:80µJ (on), 70µJ (off)
- Gate Charge:12.1 nC
- Td (on/off) @ 25° C:5.4ns/25.4ns
- Test Condition:400V, 5A, 10Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FGB5N60UNDF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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