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Transphorm TPH3208LDG
- Mfr.Part # :TPH3208LDG
- Manufacturer :Transphorm
- Dasenic # :TPH3208LDG-DS
- Datasheet : TPH3208LDG Datasheet
- Description : GANFET N-CH 650V 20A 3PQFN
- Package :-
- Quantity :Unit Price : $ 20.42Total : $ 20.42
- Delivery Time :Ship Within 48 Hours
- Shipping Origin :Shenzhen or Hong Kong Warehouse
- Delivery :
- Payment :
In Stock: 1509
( MOQ : 1 PCS )Pricing (USD) :
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Transphorm TPH3208LDG technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
Product Status:Obsolete
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:3-PowerDFN
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:3-PQFN (8x8)
Power Dissipation ( Max):96W (Tc)
F E T Type:N-Channel
F E T Feature:-
Drain to Source Voltage ( Vdss):650 V
Current - Continuous Drain ( Id) @ 25° C:20A (Tc)
Rds On ( Max) @ Id, Vgs:130mOhm @ 13A, 8V
Vgs(th) ( Max) @ Id:2.6V @ 300µA
Gate Charge ( Qg) ( Max) @ Vgs:14 nC @ 8 V
Input Capacitance ( Ciss) ( Max) @ Vds:760 pF @ 400 V
Drive Voltage ( Max Rds On, Min Rds On):10V
Vgs ( Max):±18V
EU RoHS Status:RoHS Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
US ECCN:EAR99
HTS US:8541.29.0095
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TPH3208LDG provided by Transphorm
Founded in 2007, Transphorm is a global semiconductor company, leading the GaN Revolution with the highest performance, highest reliability GaN devices for high voltage power conversion applications. To ensure this, Transphorm deploys its unique vertically-integrated business approach that leverages the industry’s most experienced GaN engineering team at every development stage: design, fabrication, device and application support. This approach, backed by one of the industry’s largest IP portfolios with over 1000 patents, has yielded the industry’s only JEDEC- and AEC-Q101-qualified GaN FETs. Transphorm’s innovations are moving power electronics beyond the limitations of silicon to achieve over 99% efficiency, 40% more power density and 20% lower system cost—and here’s how we do it.
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