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Transphorm TP90H050WS
Manufacturer # :TP90H050WS
Manufacturer :Transphorm
Dasenic # :TP90H050WS-DS
Datasheet : TP90H050WS Datasheet
Customer # :
Description : GANFET N-CH 900V 34A TO247-3
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In Stock: 2500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 24.45
Total :$ 24.45
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Payment :
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TP90H050WS information
Transphorm TP90H050WS technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Technology:GaNFET (Cascode Gallium Nitride FET)
- Supplier Device Package:TO-247-3
- Power Dissipation ( Max):119W (Tc)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):900 V
- Current - Continuous Drain ( Id) @ 25° C:34A (Tc)
- Rds On ( Max) @ Id, Vgs:63mOhm @ 22A, 10V
- Vgs(th) ( Max) @ Id:4.4V @ 700µA
- Gate Charge ( Qg) ( Max) @ Vgs:17.5 nC @ 10 V
- Input Capacitance ( Ciss) ( Max) @ Vds:980 pF @ 600 V
- Drive Voltage ( Max Rds On, Min Rds On):10V
- Vgs ( Max):±20V
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TP90H050WS provided by Transphorm
Founded in 2007, Transphorm is a global semiconductor company, leading the GaN Revolution with the highest performance, highest reliability GaN devices for high voltage power conversion applications. To ensure this, Transphorm deploys its unique vertically-integrated business approach that leverages the industry’s most experienced GaN engineering team at every development stage: design, fabrication, device and application support. This approach, backed by one of the industry’s largest IP portfolios with over 1000 patents, has yielded the industry’s only JEDEC- and AEC-Q101-qualified GaN FETs. Transphorm’s innovations are moving power electronics beyond the limitations of silicon to achieve over 99% efficiency, 40% more power density and 20% lower system cost—and here’s how we do it.
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