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Texas Instruments TMP107BIDR
Manufacturer # :TMP107BIDR
Manufacturer :Texas Instruments
Dasenic # :TMP107BIDR-DS
Datasheet : TMP107BIDR Datasheet
Customer # :
Description : SENSOR DIGITAL -55C-125C 8SOIC
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In Stock: 7995
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.539
Total :$ 1.54
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TMP107BIDR information
Texas Instruments TMP107BIDR technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Features:One-Shot, Output Switch, Programmable Limit, Shutdown Mode
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Output Type:SMAART Wire
- Supplier Device Package:8-SOIC
- Resolution:14 b
- Voltage - Supply:1.7V ~ 5.5V
- Sensor Type:Digital, Local
- Test Condition:-20°C ~ 70°C (-55°C ~ 125°C)
- Sensing Temperature - Local:-55°C ~ 125°C
- Sensing Temperature - Remote:-
- Accuracy - Highest ( Lowest):±0.4°C (±0.7°C)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMP107BIDR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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