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Texas Instruments TMP104YFFT

SENSOR DIGITAL -40C-125C 4DSBGA
part number has RoHS
Manufacturer # :TMP104YFFT
Manufacturer :Texas Instruments
Dasenic # :TMP104YFFT-DS
Customer # :
Description : SENSOR DIGITAL -40C-125C 4DSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.7167$ 0.72
25+$ 0.7024$ 17.56
100+$ 0.6737$ 67.37
500+$ 0.6450$ 322.5
1000+$ 0.6092$ 609.2
In Stock: 1621
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7167
Total :$ 0.72
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TMP104YFFT information

  • Texas Instruments TMP104YFFT technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C
  • Features:One-Shot, Output Switch, Shutdown Mode
  • Mounting Type:Surface Mount
  • Package / Case:4-UFBGA, DSBGA
  • Output Type:SMAART Wire
  • Supplier Device Package:4-DSBGA (1x1)
  • Resolution:8 b
  • Voltage - Supply:1.4V ~ 3.6V
  • Sensor Type:Digital, Local
  • Test Condition:-10°C ~ 100°C (-40°C ~ 125°C)
  • Sensing Temperature - Local:-40°C ~ 125°C
  • Sensing Temperature - Remote:-
  • Accuracy - Highest ( Lowest):±2°C (±3°C)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMP104YFFT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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