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Texas Instruments TMP103CYFFT
Manufacturer # :TMP103CYFFT
Manufacturer :Texas Instruments
Dasenic # :TMP103CYFFT-DS
Datasheet : TMP103CYFFT Datasheet
Customer # :
Description : SENSOR DIGITAL -40C-125C 4DSBGA
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In Stock: 5946
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.0802
Total :$ 1.08
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TMP103CYFFT information
Texas Instruments TMP103CYFFT technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C
- Features:One-Shot, Shutdown Mode
- Mounting Type:Surface Mount
- Package / Case:4-UFBGA, DSBGA
- Output Type:I²C/SMBus
- Supplier Device Package:4-DSBGA (1x1)
- Resolution:8 b
- Voltage - Supply:1.4V ~ 3.6V
- Sensor Type:Digital, Local
- Test Condition:-10°C ~ 100°C (-40°C ~ 125°C)
- Sensing Temperature - Local:-40°C ~ 125°C
- Sensing Temperature - Remote:-
- Accuracy - Highest ( Lowest):±2°C (±3°C)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMP103CYFFT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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