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  • Rochester Electronics ULN2803ADW

    TRANS 8NPN DARL 50V 0.5A 18SOIC
  • part number has RoHS
  • Mfr.Part # :ULN2803ADW
  • Manufacturer :Rochester Electronics
  • Dasenic # :ULN2803ADW-DS
  • Datasheet :pdf download ULN2803ADW Datasheet
  • Description : TRANS 8NPN DARL 50V 0.5A 18SOIC
  • Package :-
  • Quantity :
    Unit Price : $ 4.0687Total : $ 4.07
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 24000
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
12 +$ 4.0687$ 48.82
24 +$ 3.8063$ 91.35
37 +$ 3.6751$ 135.98
53 +$ 3.4125$ 180.86
69 +$ 3.2813$ 226.41

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Rochester Electronics ULN2803ADW technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:18-SOIC (0.295", 7.50mm Width)
Power - Max:-
Supplier Device Package:18-SOIC
Transistor Type:8 NPN Darlington
Current - Collector ( Ic) ( Max):500mA
Voltage - Collector Emitter Breakdown ( Max):50V
Vce Saturation ( Max) @ Ib, Ic:1.6V @ 500µA, 350mA
Current - Collector Cutoff ( Max):-
D C Current Gain (h F E) ( Min) @ Ic, Vce:-
Frequency - Transition:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
ULN2803ADW provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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