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Rochester Electronics TMP01FSZ

THERMOSTAT PROG ACT HIGH 8SOIC
part number has RoHS
Manufacturer # :TMP01FSZ
Manufacturer :Rochester Electronics
Dasenic # :TMP01FSZ-DS
Customer # :
Description : THERMOSTAT PROG ACT HIGH 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
12+$ 3.9006$ 46.81
29+$ 3.2004$ 92.81
44+$ 3.1005$ 136.42
60+$ 3.0006$ 180.04
78+$ 2.9007$ 226.25
In Stock: 5505
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.9006
Total :$ 3.90
Delivery :
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TMP01FSZ information

  • Rochester Electronics TMP01FSZ technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Thermostats - Solid State
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Supply:500µA
  • Output Type:Open Collector
  • Supplier Device Package:8-SOIC
  • Output:Active High
  • Voltage - Supply:4.5 V ~ 13.2 V
  • Output Function:/OverTemp, /UnderTemp
  • Accuracy:±1°C
  • Current - Output ( Max):50mA
  • Switching Temperature:Programmable
  • Trip Temperature Threshold:Cold, Hot
  • Selectable Hysteresis:Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMP01FSZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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