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Rochester Electronics TLE5027CE6747HAMA1

SENSOR MAGNETORESISTIVE PWM 3SIP
part number has RoHS
Manufacturer # :TLE5027CE6747HAMA1
Manufacturer :Rochester Electronics
Dasenic # :TLE5027CE6747HAMA1-DS
Customer # :
Description : SENSOR MAGNETORESISTIVE PWM 3SIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.6540$ 3.65
10+$ 3.1500$ 31.5
25+$ 2.7720$ 69.3
50+$ 2.5920$ 129.6
100+$ 2.2500$ 225
In Stock: 1722
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.654
Total :$ 3.65
Delivery :
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Payment :
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TLE5027CE6747HAMA1 information

  • Rochester Electronics TLE5027CE6747HAMA1 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Magnetic Sensors - Linear, Compass (ICs)
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Features:-
  • Mounting Type:Through Hole
  • Package / Case:3-SSIP Module
  • Technology:Magnetoresistive
  • Output Type:PWM
  • Supplier Device Package:PG-SSO-3-92
  • Resolution:-
  • Axis:X, Y, Z
  • Bandwidth:-
  • Voltage - Supply:-
  • Current - Supply ( Max):-
  • Sensing Range:-
  • Current - Output ( Max):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLE5027CE6747HAMA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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