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Rochester Electronics MPX2102ASX

SENSOR ABS PRESS 14.5PSI MAX
part number has RoHS
Manufacturer # :MPX2102ASX
Manufacturer :Rochester Electronics
Dasenic # :MPX2102ASX-DS
Customer # :
Description : SENSOR ABS PRESS 14.5PSI MAX
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 11.4120$ 11.41
25+$ 11.1870$ 279.68
100+$ 10.7280$ 1072.8
500+$ 10.2690$ 5134.5
1000+$ 9.7020$ 9702
In Stock: 17842
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.412
Total :$ 11.41
Delivery :
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Payment :
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MPX2102ASX information

  • Rochester Electronics MPX2102ASX technical specifications, attributes, parameters.
  • Category:Sensor Devices/Pressure Sensors, Transducers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Features:Temperature Compensated
  • Package / Case:4-SIP Module
  • Output Type:Wheatstone Bridge
  • Termination Style:PC Pin
  • Supplier Device Package:-
  • Output:0 mV ~ 40 mV (10V)
  • Voltage - Supply:10V ~ 16V
  • Accuracy:±1%
  • Operating Pressure:14.5PSI (100kPa)
  • Port Size:Male - 0.19" (4.93mm) Tube
  • Pressure Type:Absolute
  • Port Style:Barbed
  • Maximum Pressure:58.02PSI (400kPa)
  • Applications:Board Mount
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MPX2102ASX provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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