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1 : $1.0312
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Rochester Electronics LM57FSPWQ1
THERMOSTAT PROG ACT HI/LO 8TSSOP
Manufacturer # :LM57FSPWQ1
Manufacturer :Rochester Electronics
Dasenic # :LM57FSPWQ1-DS
Datasheet :
LM57FSPWQ1 Datasheet
LM57FSPWQ1 DatasheetCustomer # :
Description : THERMOSTAT PROG ACT HI/LO 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 150+ | $ 1.0312 | $ 154.68 |
In Stock: 39060
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.0312
Total :$ 1.03
Delivery :
Payment :
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LM57FSPWQ1 information
Rochester Electronics LM57FSPWQ1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Thermostats - Solid State
- Product Status:Active
- Operating Temperature:-50°C ~ 160°C
- Features:Selectable Trip Point, Trip Test
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Current - Supply:26µA
- Output Type:Open Drain, Push-Pull
- Supplier Device Package:8-TSSOP
- Output:Active High, Active Low
- Voltage - Supply:2.4 V ~ 5.5 V
- Output Function:OverTemp, /OverTemp
- Accuracy:±2.3°C
- Current - Output ( Max):5mA
- Switching Temperature:Programmable
- Trip Temperature Threshold:Hot
- Selectable Hysteresis:No
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM57FSPWQ1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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