Name: HGT1S3N60A4DS9A
Brand: Onsemi
SKU: DS-6236907
Price: 1.638 USD
Availability: InStock
Rating: 4.8 (3 reviews)

Images are for reference only.

1 : $1.6380

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Onsemi HGT1S3N60A4DS9A

IGBT 600V 17A 70W D2PAK

Manufacturer # :HGT1S3N60A4DS9A

Manufacturer :Onsemi

Dasenic # :HGT1S3N60A4DS9A-DS

Datasheet :

HGT1S3N60A4DS9A Datasheet

Customer # :

Customer #

Description : IGBT 600V 17A 70W D2PAK

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 1.6380	$ 1.64
25+	$ 1.6020	$ 40.05
100+	$ 1.5390	$ 153.9
500+	$ 1.4760	$ 738
1000+	$ 1.3950	$ 1395

In Stock: 14139

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 1.638

Total :$ 1.64

Delivery :

Payment :

Help you to save your cost and time

Strict quality inspection and Reliable package for goods

Fast Reliable delivery to save time

Provide 365 days warranty after-sales service

HGT1S3N60A4DS9A information

Onsemi HGT1S3N60A4DS9A technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
Product Status:Obsolete
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Input Type:Standard
Power - Max:70 W
Supplier Device Package:D2PAK (TO-263)
Reverse Recovery Time (trr):29 ns
Current - Collector ( Ic) ( Max):17 A
Voltage - Collector Emitter Breakdown ( Max):600 V
I G B T Type:-
Vce(on) ( Max) @ Vge, Ic:2.7V @ 15V, 3A
Current - Collector Pulsed ( Icm):40 A
Switching Energy:37µJ (on), 25µJ (off)
Gate Charge:21 nC
Td (on/off) @ 25° C:6ns/73ns
Test Condition:390V, 3A, 50Ohm, 15V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Onsemi HGT1S3N60A4DS9A
Datasheet:
HGT1S3N60A4DS9A,

Onsemi HGT1S3N60A4DS9A Environmental and export classification status description

1.Sign in or as a visitor

You can place an order after registration or purchase products directly as a visitor.

2.Search product

Search to find the part number of the product you need to order.

3.Add to cart

After finding the product. Then add the products to your shopping cart directly.

4.Filling Address and Secure Checkout

Please fill the shipping address and express information when placing your order.

5.Pay the orders

You can pay the orders on the website directly or pay by wire transfer offline. We support: Paypal ,VISA , WIRE TRANSFER.

6.Tracking Your Order

We will dispatch your order within 24 hours and provide you with a tracking number. You can also check the order information on the website or contact our sales staff for tracking.

Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

HGT1S3N60A4DS9A provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.