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Rochester Electronics HFA3127B96-HC
RF 0.037A, 5-ELEMENT, ULTRA HIGH
Manufacturer # :HFA3127B96-HC
Manufacturer :Rochester Electronics
Dasenic # :HFA3127B96-HC-DS
Datasheet :
HFA3127B96-HC Datasheet
HFA3127B96-HC DatasheetCustomer # :
Description : RF 0.037A, 5-ELEMENT, ULTRA HIGH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 102+ | $ 2.6640 | $ 271.73 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.664
Total :$ 2.66
Delivery :
Payment :
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HFA3127B96-HC information
Rochester Electronics HFA3127B96-HC technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Power - Max:150mW
- Supplier Device Package:16-SOIC
- Transistor Type:5 NPN
- Current - Collector ( Ic) ( Max):65mA
- Voltage - Collector Emitter Breakdown ( Max):12V
- D C Current Gain (h F E) ( Min) @ Ic, Vce:40 @ 10mA, 2V
- Frequency - Transition:8GHz
- Noise Figure (d B Typ @ f):3.5dB @ 1GHz
- Gain:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HFA3127B96-HC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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